Encapsulation/Potting Shells
Source: Resdel Corporation
These round epoxy encapsulation cups are designed for electronic
Resdel Corporation epoxy encapsulation cups are designed for electronic component packaging. These cups are available in a variety of sizes, and are constructed of epoxy, which provides a rigid housing with mechanical strength and dielectric properties. In addition, all resin formulations are chemically compatible with typical encapsulating materials such as epoxies, urethanes, and silicones.
<%=company%>, Cape May County Industrial Park, Rio Grande, NJ 08242 Phone: (609) 886-1111 Fax: (609) 886-6329
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