Defect Inspection Tool
Source: KLA-Tencor Instruments
The new AIT III tool is designed to provide high-throughput darkfield inspection with the increased sensitivity needed to capture extremely small defects and defect types that result from the transition to 0.13 µm and smaller design rules and dual damascene processing
The new AIT III tool is designed to provide high-throughput darkfield inspection with the increased sensitivity needed to capture extremely small defects and defect types that result from the transition to 0.13 µm and smaller design rules and dual damascene processing. The manufacturer's installed base of AIT IIs can be upgraded to this new version.
This tool provides defect capture by suppressing color variation and grain noise. It also provides surface selectivity to minimize detection of previous layer defects. The tool is well suited for film, etch, and chemical mechanical planarization (CMP) tool monitoring applications.
Features include:
- Double darkfield laser scanning technology
- New Defect Signal Enhancement Technology (DSET )
- MultiSpot illumination
- Additional collector for high angle scatter
- System-to-system matching
- Binning and online high resolution automatic defect classification
- PMC-Net connectivity
- 200-mm/300-mm bridge tool
KLA-Tencor Instruments, 160 Rio Robles, San Jose, CA 95134. Tel: 408-875-4200. Fax: 408-434-4270.
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