UV Wafer Inspection Tool
Source: KLA-Tencor Instruments
The new 2350 UV wafer inspection tool features ultra-broadband brightfield illumination to enable the resolution of circuit patterns and defects for 0.13-µ production and 0.1-µ development applications
The new 2350 UV wafer inspection tool features ultra-broadband brightfield illumination to enable the resolution of circuit patterns and defects for 0.13-µ production and 0.1-µ development applications.
According to the manufacturer, the tool incorporates improved image computer and software to provide a two-fold increase in throughput over their previous generation 21xx platform. The tool also includes new optical modes that provide noise suppression and contrast enhancements on the back end of the line and lithography layers.
Features of this tool also include:
- 800 mpps (megapixels per second) image computer and improved-accuracy stage design
- In-line automatic defect classification
- High resolution review
- PMC-Net connectivity
- Multiple configurations for wager loading
- 200-mm/300-mm bridge tool
- Mass Memory Edge Die (MMED)
KLA-Tencor Instruments, 160 Rio Robles, San Jose, CA 95134. Tel: 408-875-4200. Fax: 408-434-4270.
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