Fixed Abrasive CMP Consumable

This company's SlurryFree CMP matrix is a fixed abrasive Chemical Mechanical Planarization (CMP) consumable. Used for oxide CMP of semiconductor wafers, the matrix is specifically designed for single-step, shallow trench isolation (STI) and for inter-layer dielectric (ILD) applications using web-based CMP tools.

According to the manufacturer, the matrix provides repeatable, precise process performance needed in advanced geometry STI applications. In addition, it features a distinct roll-based format that last weeks between "pad" changes.

3M Abrasive Systems Division, 3M Center Building 223-6N-01, St. Paul, MN 55144-1000. Tel: 612-733-6102. Fax: 612-736-3094.